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Benchmarking Study on the Thermal Management Landscape for Three Dimensional Integrated Circuits: From Back Side to Volumetric Heat Removal
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An overview of the thermal management landscape with focus on heat dissipation from threedimensional (3D) chip stacks is provided in this study. Evolutionary and revolutionary topologies, such as singleside, dualside, and ...
Enhanced Electrical and Thermal Interconnects by the Self Assembly of Nanoparticle Necks Utilizing Capillary Bridging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This work presents enhanced composite joints that support both electrical and thermal transport in electronic packages. The joints are sequentially formed by applying a nanoparticle suspension, evaporating a solvent, ...
Lid Integral Cold Plate Topology: Integration, Performance, and Reliability
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: We demonstrate the lidintegral silicon coldplate topology as a way to bring liquid cooling closer to the heat source integrated circuit (IC). It allows us to eliminate one thermal interface material (TIM2), to establish ...
Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Heat dissipation from three-dimensional (3D) chip stacks can cause large thermal gradients due to the accumulation of dissipated heat and thermal interfaces from each integrated die. To reduce the overall thermal resistance ...
Erratum: “Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks” [ASME J. Electron. Packag., 2016, 138(4), p. 041009; DOI: 10.1115/1.4034927]
Publisher: The American Society of Mechanical Engineers (ASME)